Edge plating 6 layer pcb for IOT main board

6 layer pcb with edge plated . UL certified Shengyi S1000H tg 170 FR4 material, 1/1/1/1/1/1 OZ(35um) copper thickness, ENIG  Au Thickness 0.05um; Ni Thickness 3um. Minimum via 0.203 mm filled with resin.

FOB Price:US $0.2/Piece

Min Order Quantity(MOQ):1 PCS

Supply Capability:100,000,000 PCS per month

Payment Terms: T/T/, L/C, PayPal,Payoneer

Shipping way: By Express/by Air/ by Sea

Product Detail

Product Tags

Layers 6 layers
Board thickness 1.60MM
Material FR4 tg170
Copper thickness 1/1/1/1/1/1 OZ(35um)
Surface Finish ENIG  Au Thickness 0.05um; Ni Thickness 3um
Min Hole(mm) 0.203mm filled with resin
Min Line Width(mm) 0.13mm
Min Line Space(mm) 0.13mm
Solder Mask Green
 Legend Color White
Mechanical processing V-scoring, CNC Milling(routing)
Packing Anti-static bag
E-test Flying probe or Fixture
Acceptance standard IPC-A-600H Class 2
Application Automotive electronics


Product Material

As a supplier of various PCB technologies, volumes, lead time options, we have a selection of standard materials with which a large bandwidth of the variety of types of PCB can be covered and which are always available in house.

Requirements for other or for special materials can also be met in most cases, but, depending upon the exact requirements, up to about 10 working days may be needed to procure the material.

Do get in touch with us and discuss your needs with one of our sales or CAM team.

Standard materials held in stock:



Thickness Tolerance

Weave type

Internal layers

0,05mm +/-10%


Internal layers

0.10mm +/-10%


Internal layers

0,13mm +/-10%


Internal layers

0,15mm +/-10%


Internal layers

0.20mm +/-10%


Internal layers

0,25mm +/-10%

2 x 1504

Internal layers

0.30mm +/-10%

2 x 1501

Internal layers

0.36mm +/-10%

2 x 7628

Internal layers

0,41mm +/-10%

2 x 7628

Internal layers

0,51mm +/-10%

3 x 7628/2116

Internal layers

0,61mm +/-10%

3 x 7628

Internal layers

0.71mm +/-10%

4 x 7628

Internal layers

0,80mm +/-10%

4 x 7628/1080

Internal layers

1,0mm +/-10%

5 x7628/2116

Internal layers

1,2mm +/-10%

6 x7628/2116

Internal layers

1,55mm +/-10%

8 x7628


0.058mm* Depends on layout



0.084mm* Depends on layout



0.112mm* Depends on layout



0.205mm* Depends on layout



Cu thickness for internal layers: Standard – 18µm and 35 µm,

on request 70 µm, 105µm and 140µm

Material type: FR4

Tg: approx. 150°C, 170°C, 180°C

εr at 1 MHz: ≤5,4 (typical: 4,7) More available on request


The main 6 layer stackup configuration will be generally as below:







6 layer pcb with edge plating

Q&A How To Test Hole Wall Tensile And Related Specifications

How to test hole wall tensile and related specifications? Hole wall pull away the causes and solutions?

Hole wall pull test was applied previously for through-hole parts to meet assembling requirements. General test is to solder a wire onto the pcb board through holes and then measure the pull out value by the tension meter. Accords to the experiences, general values are very high, which makes almost no  problems in application. Product specifications varies according

to different requirements, it is recommended referring to IPC related specifications.

Hole wall separation problem is the issue of poor adhesion, which generally caused by two common reasons, first one is the grip of poor desmear (Desmear) makes the tension not enough. The other is the electroless copper plating process or directly gold plated, For example: the growth of thick, bulky stack will result in poor adhesion. Of course there are other potential factors may effect such problem, however these two factors are the most common problems.

There two disadvantages of hole wall separation, the first one of course is a test operating environment too harsh or strict, will result in a pcb board can not withstand physical stress so that it is separated. If this problem is difficult to solve, maybe you have to change the laminate material to meet improvement. 

If it is not the above problem, it is mostly due to the poor adhesion between the hole copper and the hole wall. The possible reasons for this part include insufficient roughening of the hole wall, excessive thickness of chemical copper, and interface defects caused by poor chemical copper process treatment. These are all is a possible reason. Of course, if the drilling quality is poor, the shape variation of the hole wall may also cause such problems. As for the most basic work to solve these problems, it should be to first confirm the root cause and then deal with the source of the cause before it can be completely solved.

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