At ANKE PCB, standard PCB services refer to full-featured printed circuit board manufacturing services. With over 10 years PCB manufacturing experiences, we have handled thousands of PCB projects covering almost every type of substrate material including FR4, Aluminum, Rogers and more. This page only refers to standard FR4 based PCBs. For PCBs with special technical substrates, please refer to the corresponding web pages for information or feel free to drop us mail at info@anke-pcb.com.
Different with pcb sampling, standard PCB has tighter production tolerances and more stable production quality.
Standard PCB services are recommended when your design is ready to transform from prototype to production. We can produce up to 10 million high quality PCBs in just 2 days. To give your project the desired functionality and more possibilities, we offer advanced features for standard PCB services. The comprehensive ability is shown as below:
The Comprehensive Ability
|
Feature |
Capability |
|
Quality Grade |
Standard IPC 2 |
|
Number of Layers |
1 - 42layers |
|
Order Quantity |
1pc - 10,000,000 pcs |
|
Lead time |
1 day - 5weeks (Expedited Service) |
|
Material |
FR-4 Standard Tg 150°C, FR4-High Tg 170°C, FR4-High-Tg180°C,FR4-Halogen-free, FR4-Halogen-free & High-Tg |
|
Board Size |
610*1100mm |
|
Board size tolerance |
±0.1mm - ±0.3mm |
|
Board Thickness |
0.2-0.65mm |
|
Board Thickness Tolerance |
±0.1mm - ±10% |
|
Copper Weight |
1-6OZ |
|
Inner Layer Copper Weight |
1-4OZ |
|
Copper Thickness Tolerance |
+0μm +20μm |
|
Min Tracing/Spacing |
3mil/3mil |
|
Solder Mask Sides |
As per the file |
|
Solder Mask Color |
Green, White, Blue, Black, Red, Yellow |
|
Silkscreen Sides |
As per the file |
|
Silkscreen Color |
White, Blue, Black, Red, Yellow |
|
Surface Finish |
HASL - Hot Air Solder Leveling Lead Free HASL - RoHS ENIG - Electroless Nickle/Immersion Gold - RoHS ENEPIG - Electroless Nickel Electroless Palladium Immersion Gold - RoHS Immersion Silver - RoHS Immersion Tin - RoHS OSP -Organic Solderability Preservatives - RoHS Selective Gold Plating, Gold thickness up to 3um(120u”) |
|
Min Annular Ring |
3mil |
|
Min Drilling Hole Diameter |
6mil, 4mil-laser drill |
|
Min Width of Cutout (NPTH) |
Min Width of Cutout (NPTH) |
|
NPTH Hole Size Tolerance |
±.002" (±0.05mm) |
|
Min Width of Slot Hole (PTH) |
0.6mm |
|
PTH Hole Size Tolerance |
±.003" (±0.08mm) - ±4mil |
|
Surface/Hole Plating Thickness |
20μm - 30μm |
|
SM Tolerance (LPI) |
0.003" (0.075mm) |
|
Aspect Ratio |
1.10 (hole size: board thickness) |
|
Test |
10V - 250V, flying probe or testing fixture |
|
Impedance tolerance |
±5% - ±10% |
|
SMD Pitch |
0.2mm(8mil) |
|
BGA Pitch |
0.2mm(8mil) |
|
Chamfer of Gold Fingers |
20, 30, 45, 60 |
|
Other Techniques |
Gold fingers Blind and Buried Holes peelable solder mask Edge plating Carbon Mask Kapton tape Countersink/counterbore hole Half-cut/Castellated hole Press fit hole Via tented/covered with resin Via plugged/filled with resin Via in pad Electrical Test |
