Package On Package

With modem life and technology changes, when people are asked about their long-standing need for electronics, they don't hesitate to answer the following key words: smaller, lighter, faster, more functional. In order to adapt modern electronic products to these demands, advanced printed circuit board assembly technology has been widely introduced and applied, among which PoP (Package on Package) technology has gained millions of supporters.


Package on Package

Package on Package is actually the process of stacking components or ICs (Integrated Circuits) on a motherboard. As an advanced packaging method, PoP allows the integration of multiple ICs into a single package, with logic and memory in top and bottom packages, increasing storage density and performance and reducing mounting area. PoP can be divided into two structures: standard structure and TMV structure. Standard structures contain logic devices in the bottom package and memory devices or stacked memory in the top package. As an upgraded version of the PoP standard structure, the TMV (Through Mold Via) structure realizes the internal connection between the logic device and the memory device through the mold through hole of the bottom package.

Package-on-package involves two key technologies: pre-stacked PoP and on-board stacked PoP. The main difference between them is the number of reflows: the former passes through two reflows, while the latter passes through once.


Advantage of POP

PoP technology is being widely applied by OEMs owing to its impressively advantages:

• Flexibility - Stacking structure of PoP provides OEMs such multiple selections of stacking that they are able to modify functions of their products easily.

• Overall size reduction

• Lowering overall cost

• Reducing motherboard complexity

• Improving logistics management

• Enhancing technology reuse level