| Order Quantity | ≥1PCS |
| Quality Grade | IPC-A-610 |
| Lead Time | 48H for expedite; |
| 4-5 days for prototype; | |
| Other quantity provide when quoting | |
| Size | 50*50mm-510*460mm |
| Board Type | Rigid |
| Flexible | |
| Rigid-flexible | |
| Metal core | |
| Min Package | 01005(0.4mm*0.2mm) |
| Mounting Accuracy | ±0.035mm(±0.025mm)Cpk≥1.0 |
| Surface Finish | Lead/Lead FREE HASL,Immersion gold, OSP,etc |
| Assembly Type | THD (Thru-hole device) / Conventional |
| SMT (Surface-mount technology) | |
| SMT & THD mixed | |
| Double-sided SMT and/or THD assembly | |
| Components Sourcing | Turnkey(All components sourced by ANKE), partial turnkey, Consigned |
| BGA Package | BGA Dia 0.14mm, BGA 0.2MM Pitch |
| Component packaging | Reels,Cut tape,Tube,Tray,Loose parts |
| Cable Assembly | Custom cables,cable assemblies,wiring/harness |
| Stencil | Stencil with or without frame |
| Design file format | Gerber RS-274X, 274D, Eagle and AutoCAD’s DXF, DWG |
| BOM (Bill of Materials) | |
| Pick and Place file (XYRS) | |
| Quality Inspection | X-ray Inspection, |
| AOI (Automated Optical Inspector), | |
| Functional test (test modules need to be supplied) | |
| Burn-in test | |
| SMT Capacity | 3 Million-4 Million soldering pad/day |
| DIP capacity | 100 Thousand pin/day |
Post time: Sep-05-2022
